发明名称 |
Thin film capacity element composition, high-permittivity insulation film, thin film capacity element, thin film multilayer capacitor, electronic circuit and electronic apparatus |
摘要 |
A thin film capacity element composition includes a first bismuth layer-structured compound having positive temperature characteristics, that a specific permittivity rises as the temperature rises, in at least a part of a predetermined temperature range and a second bismuth layer-structured compound having negative temperature characteristics, that a specific permittivity declines as a temperature rises, in at least a part of said predetermined temperature range at any mixing ratio; wherein the bismuth layer-structured compound is expressed by a composition formula of Ca<SUB>x</SUB>Sr<SUB>(1-x)</SUB>Bi<SUB>4</SUB>Ti<SUB>4</SUB>O<SUB>15</SUB>.
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申请公布号 |
US2006098385(A1) |
申请公布日期 |
2006.05.11 |
申请号 |
US20050547134 |
申请日期 |
2005.08.26 |
申请人 |
TDK CORPORATION |
发明人 |
SAKASHITA YUKIO;FUNAKUBO HIROSHI |
分类号 |
H01G2/00;H01G4/12;H01G4/20;H01G4/33;H01L27/04;H01L27/108 |
主分类号 |
H01G2/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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