发明名称 Thin film capacity element composition, high-permittivity insulation film, thin film capacity element, thin film multilayer capacitor, electronic circuit and electronic apparatus
摘要 A thin film capacity element composition includes a first bismuth layer-structured compound having positive temperature characteristics, that a specific permittivity rises as the temperature rises, in at least a part of a predetermined temperature range and a second bismuth layer-structured compound having negative temperature characteristics, that a specific permittivity declines as a temperature rises, in at least a part of said predetermined temperature range at any mixing ratio; wherein the bismuth layer-structured compound is expressed by a composition formula of Ca<SUB>x</SUB>Sr<SUB>(1-x)</SUB>Bi<SUB>4</SUB>Ti<SUB>4</SUB>O<SUB>15</SUB>.
申请公布号 US2006098385(A1) 申请公布日期 2006.05.11
申请号 US20050547134 申请日期 2005.08.26
申请人 TDK CORPORATION 发明人 SAKASHITA YUKIO;FUNAKUBO HIROSHI
分类号 H01G2/00;H01G4/12;H01G4/20;H01G4/33;H01L27/04;H01L27/108 主分类号 H01G2/00
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