发明名称 METHOD AND DEVICE FOR APPLYING VIBRATION AND PRESSURE
摘要 PROBLEM TO BE SOLVED: To solve the problem, wherein a method of serially connecting vibrators is ineffective for an object, such as a wafer that requires a large area and a high load, particularly in a jointing apparatus or a molding apparatus, even though the method has been employed conventionally. SOLUTION: Connecting a plurality of piezo actuators in parallel yields increased energy and enables large-area vibration. In addition, arranging a plurality of the actuators enables prevention of bending and also to vibrate a large area under high load and increasing the energy. Furthermore, a three-dimensional operation becomes possible. This is effective for lowering the loads and reduce voids at joints; in nano-level molding equipment, allows vibration to operate effectively, when molding or stripping the mold, and provides a structure effective for the objects, intended for both of the two apparatuses mainly to deal with, such as wafers for which large areas and high loads are required. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006121061(A) 申请公布日期 2006.05.11
申请号 JP20050275568 申请日期 2005.09.22
申请人 BONDOTEKKU:KK 发明人 OKADA MASUAKI
分类号 H01L21/02;H01L21/60 主分类号 H01L21/02
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