| 摘要 |
A semiconductor multichip module includes a plurality of semiconductor chips, a static plate having a plurality of insertion holes for receiving the plurality of chips, a shield cap attached onto the lower surface of the static plate for preventing the chips from deviating downward through the insertion holes, an external terminal unit formed over the chips for externally transmitting electrical signals of the chips, and a plurality of clip-type clamp springs clamping the shield cap and the external terminal unit for preventing the chips from externally deviating. The multichip module improves productivity by decreasing production hours and enables effective chips to be easily replaced with normal chips by disassembling and reassembling the clamp springs. |
