发明名称 WAFER-IMAGING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To reduce the burden of readjustment, etc. after a mask mark has been finely regulated, in particular by enabling responding also to deflecting for each of a plurality of mask marks which can always hold mutual position relation fixed with respect to the mask mark. <P>SOLUTION: Mask marks M1 to M3 are respectively formed of a plurality of through holes. Light and darkness of clear density are formed by a first through hole 60 and a second through hole 62 and a partition part 70 which is formed among them. Thus, the position of the mask mark M1 (M2, M3) of the direction of X is specified with a dimension A. The dimension B in the direction of Y is specified by a third through hole 64 and a fourth through hole 66 and a partition part 72 between them. The relative position of the field region 54A and the mask mark M1 (M2, M3) can be corrected by the dimensions A, B. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006120777(A) 申请公布日期 2006.05.11
申请号 JP20040305625 申请日期 2004.10.20
申请人 NSK LTD 发明人 GOTO TEI
分类号 H01L21/027;G03F9/00 主分类号 H01L21/027
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