发明名称 WIRING CIRCUIT BOARD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a wiring circuit board including a terminal with molten metal surely located on the terminal to be accurately connectable with an external terminal. <P>SOLUTION: A base insulation layer 3 is formed on a support substrate 2. A conductor pattern 4 is formed on the base insulation layer 3, so that it integrally includes a plurality of wires 4a, 4b, 4c and 4d, each magnetic head connection terminal 7 and each external connection terminal 8, and a first through hole 9 is formed on the external connection terminal 8. Then, after a cover insulation layer 10 is formed, a third through hole 20 is formed on the support substrate 2, and a second through hole 19 is formed on the base insulation layer 3 so that they communicate with the first through hole 9, respectively. Thus, when each external connection terminal 8 is to be connected with an external terminal 23, it can be connected while checking the location of a solder ball 21 through the respective through holes. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2006120863(A) 申请公布日期 2006.05.11
申请号 JP20040307265 申请日期 2004.10.21
申请人 NITTO DENKO CORP 发明人 KANEKAWA HITONORI;OSAWA TETSUYA;OYABU KYOYA
分类号 H05K1/11;H05K1/02;H05K1/05 主分类号 H05K1/11
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