| 摘要 |
PROBLEM TO BE SOLVED: To form a via of high reliability at a high speed. SOLUTION: A step (a) for preparing a board 10 comprising a base material 410, a first metal layer 110 provided on one side of the base material, and a second metal layer 210 provided on the other side of the base material; a step (b) for selectively removing the first metal layer 110 and the base material to form a hole 101 reaching the second metal layer 210; and a step (c) for depositing a metal 311 on the surface of the second metal layer 210 in the hole and further plate-growing the metal 311 until it contacts the first metal layer 110, by using an electroplating to fill the inside of the hole 101 with the metal 311, are performed in this order. COPYRIGHT: (C)2006,JPO&NCIPI
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