| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board wherein a bending position, while not being installed as a slit for bending, is specified, as well as its manufacturing method. SOLUTION: The printed wiring board is provided with a wiring pattern, made of conductive metal on at least one surface of an insulating film, its terminal is exposed on the surface of the wiring pattern, and a solder resist layer is formed thereon. Thus, the rigidity of the printed wiring board can be changed by changing the bending position thereof. In this case, the bending position can be specified in COFs or the like. COPYRIGHT: (C)2006,JPO&NCIPI
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