发明名称 SUBSTRATE HEAT TREATMENT APPARATUS AND SUBSTRATE TRANSFER TRAY USED IN SUBSTRATE HEAT TREATMENT
摘要 [PROBLEMS] To provide a substrate heat treatment apparatus which can suppress generation of a rough surface of a substrate to which heat treatment is performed. [MEANS FOR SOLVING PROBLEMS] The substrate heat treatment apparatus is provided with a heating means for performing heat treatment to a substrate arranged in a treatment chamber which can be evacuated, and the apparatus performs heat treatment to the substrate arranged in the treatment chamber by the heating means. A susceptor is arranged between the heating means and the substrate, and a susceptor surface on a side whereupon the substrate is arranged is covered with a member which does not discharge a gas while the substrate heat treatment is performed. A heat receiving body for receiving heat from the heating means through the susceptor is arranged on a side which faces the susceptor by having the substrate in between, and a surface of the heat receiving body on the side whereupon the substrate is arranged is covered with a member which does not discharge a gas while the substrate heat treatment is performed.
申请公布号 WO2006043530(A1) 申请公布日期 2006.04.27
申请号 WO2005JP19090 申请日期 2005.10.18
申请人 CANON ANELVA CORPORATION;SHIBAGAKI, MASAMI;KUREMATSU, YASUMI 发明人 SHIBAGAKI, MASAMI;KUREMATSU, YASUMI
分类号 H01L21/324;H01L21/26;H01L21/673 主分类号 H01L21/324
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