| 摘要 |
<p>A tray for semiconductor packages and a manufacturing method thereof are provided to fix firmly pockets to a main body by surrounding the pockets around insides and upper and lower surfaces of holes and by covering the pockets over protrusion parts. A tray for semiconductor packages includes a main body(110) with first material, plural fixing holes(114), and pockets(120) with second material. The fixing holes are formed to penetrate through the main body. The pockets surrounded fixing holes supply spaces for holding semiconductor packages. Guidance spaces implemented between at least one pairs of the fixing holes guide the second material to the fixing holes.</p> |
