发明名称 |
Integrated circuit package system including ribbon bond interconnect |
摘要 |
An integrated circuit package system, including a ribbon bond interconnect, has a semiconductor device with at least one pad thereon. An external connection is provided. A heavy ribbon is provided and bonded to the external connection and to the pad on the semiconductor device. |
申请公布号 |
US7443018(B2) |
申请公布日期 |
2008.10.28 |
申请号 |
US20050164087 |
申请日期 |
2005.11.09 |
申请人 |
STATS CHIPPAC LTD.;ORTHODYNE ELECTRONICS CORPORATION |
发明人 |
ONG YOU YANG;CHUNG KWANG YONG;AHMAD MOHD HELMY BIN;WONG GARRETT L.;LUECHINGER CHRISTOPH B. |
分类号 |
H01L23/04;H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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