An absorption pad for semiconductor packages is provided to reduce work time by utilizing one absorption pad without exchanging the absorption pad even when types of the semiconductor packages to be absorbed vary. An absorption pad for semiconductor packages includes a body(110) and at least one soft sealing member. The body includes an air absorption hole(131). The soft sealing member flexibly transformed according to surface shapes of absorption objectors seals an absorption space(S) which is connected to the air absorption hole. The soft sealing member is a flange(120) connected to a lower portion of the body. The flange and the body are implemented as one assembly.
