| 发明名称 |
IMPROVED SINGULATION SYSTEM AND METHOD |
| 摘要 |
<p>A system for singulating an IC unit from a substrate, said IC unit having a combination of linear and non-linear peripheral edges, said system comprising a profile cutting device for cutting the non-linear portions of the IC unit; a longitudinal cutting device for cutting the linear portions of the IC unit, said cutting means located within a singulation zone.</p> |
| 申请公布号 |
KR20080084813(A) |
申请公布日期 |
2008.09.19 |
| 申请号 |
KR20087015004 |
申请日期 |
2008.06.20 |
| 申请人 |
ROKKO SYSTEMS PTE LTD. |
发明人 |
LIM CHONG CHEN GARY;BAEK, SEUNG HO;JUNG, JONG JAE;SHIN, YUN SUK;SHEN XUE FANG;LING NEE SENG;ANG SOO LOO |
| 分类号 |
H01L21/78;H01L21/02;H01L21/301 |
主分类号 |
H01L21/78 |
| 代理机构 |
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