PRINTED CIRCUIT BOARD, LIGHT EMITTING DEVICE CONTAINING SAME, AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a printed circuit board which can dissipate effectively the generated heat of a light emitting device.

SOLUTION: The printed circuit board 10 includes a first metal layer 12, an insulating layer 14 placed on the first metal layer, and a second metal layer 16 placed on the insulating layer. A mounting groove 40 which has a depth reaching at least the upper surface of the first metal layer 12 is formed to mount a light emitting element package 50.

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