发明名称 LEAD PORTION CONNECTION METHOD AND LEAD PORTION CONNECTING STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a connecting method capable of preventing a wire from being broken after the wire led out of an electronic component is connected to a terminal. SOLUTION: A lead portion 7a of a wire 7 led out of the electronic component 5 is bound together with the terminal 3, protruding from a bobbin 2 of an insulating resin, and is solder-bonded. A block body 10 of a height lower than the terminal 3 is provided on the end surface of the bobbin 2 from which the terminal 3 is protruded, and the lead portion 7a is bound together with the part of a height beyond the block body 10 in the terminal 3, and solder-bonded. The block body 10 may be removed from the bobbin 2 after solder bonding, if the body is formed of an insulating resin, it may be left on the bobbin 2. Furthermore, a collar may be formed at an intermediate part of the terminal instead of the block body 10. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008160035(A) 申请公布日期 2008.07.10
申请号 JP20060350183 申请日期 2006.12.26
申请人 SHINDENGEN ELECTRIC MFG CO LTD 发明人 IGARASHI KOJI;OKAMOTO MIKIO
分类号 H01F27/28;H01R4/02;H05K3/34 主分类号 H01F27/28
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