| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate mounting method that forms a clean solder print form, for releasing the gas generated during a flow process which is performed after an electronic component is inserted, to the outside. SOLUTION: A through hole in which a lead of an electronic component is inserted is provided with a counter sunk near the surface of a substrate which is larger than a lead thickness. The substrate, of which a plating layer is formed on the inside surface of the through hole comprising the counter-sunk, is provided with a first protruding part corresponding to the through hole provided with the counter-sunk. The component mounting method includes a solder print process in which a metal mask, having such shape as the length of the first protruding part is longer than the depth of the counter-sunk, is set for solder printing, a mounting process in which, after the solder print, the lead of an electronic component is penetrated into the hole connected to the through hole provided with the counter-sunk, and a process for reflowing the substrate on which the electronic component is mounted. COPYRIGHT: (C)2008,JPO&INPIT
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