METHOD OF FORMING ELECTRONIC PACKAGE

摘要

PROBLEM TO BE SOLVED: To disclose a method of manufacturing a near-chip scale packaging (CSP) lead-counts lead frame and partially pattern-formed lead frame package.

SOLUTION: An electronic package is provided by using a partially pattern-formed metal strip (100), one of whose side being formed into a lead frame like a wave in a main part of stages of manufacturing process. A bottom side of the metal lead frame is subjected to patterning only after a front side including chips (140) and wires (160) is hermetically sealed, and chip pads and wire bond contacts (113) are insulated. A resultant insulated package enables a strip test and singulation of high reliability without cutting metal further.

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