| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a collective packaging method of electronic components in which a plurality of electronic components are press-bonded uniformly to an insulating layer in a short period of time when the electronic components and a resin layer are bonded to each other. <P>SOLUTION: When a substrate 200 with a built-in a plurality of semiconductor devices 220 is produced, the plurality of semiconductor devices 220 are mounted on an uncured resin layer 212 and then contained in the container 31 of a hot press 3. Then, the plurality of semiconductor devices 220 are press-bonded to the uncured resin layer 212 simultaneously while heating and stiffening the resin layer 212 by pressing the plurality of semiconductor devices 220 simultaneously, collectively and isotropically by using the gas in the container 31 as a pressure medium. The plurality of semiconductor devices 220 are secured to the resin layer 212 collectively and uniformly, and packaged without being affected by state change of the resin layer 212 thereby. <P>COPYRIGHT: (C)2008,JPO&INPIT |
