| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To attach a bonding sheet to a wafer face without mixing air between the bonding sheet and the wafer when the bonding sheet is attached to the wafer by applying a pressing force. <P>SOLUTION: A support 11 in which a bonding sheet S is stretched so as to block an inner space F1 of a ring frame F is formed of a support forming means 12. In a state that a wafer W is supported on an attachment table 31 of an attachment means 14, the support 11 is transferred so that the wafer W is placed in the inner space F1. On the pressing face 41 of a pressing member 32, the relative pressure of first and second spaces S1, S2 in a case C is changed, thereby generating the pressing force from a central part toward the outside, and the bonding sheet S is attached to the wafer by the pressing force. After the bonding sheet S is attached to the wafer W, a robot 60 cuts it so as to match a shape of the wafer W by means of a cutting blade 63. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
