| 摘要 |
PROBLEM TO BE SOLVED: To provide a multi-layer wiring substrate which controls the sintering contraction in X-Y directions, a conductor of via hole will not significantly protrude from the surface of the wiring substrate, and has a proper mounting, and to provide its manufacturing method. SOLUTION: The multi-layer wiring substrate, which is formed by simultaneous sintering, includes: an insulating substrate 1 where a first insulating layer made up of glass ceramics and a second insulating layer, which is constituted of a glass ceramic, such that a starting temperature of sintering temperature is higher than the ending temperature of sintering contraction of the glass ceramics forming the first insulating layer, are laminated alternately; a surface wiring conductor layer 2 which is formed on the surface of the insulating substrate 1 with metal powder sintered; and a via hole conductor 4 which is connected with the surface wiring conductor layer 2 with metal powder sintered. A conductive particle at a position, covering at least the via hole conductor 4 of the surface wiring conductor layer 2, is a flattened particle 21 which extends longer than the thickness of the surface wiring conductor layer 2, and a mean diameter of the flattened particle 21, as viewed from the laminating direction of the insulating substrate 1, is larger than three times the mean particle diameter of the via hole conductor 4. COPYRIGHT: (C)2008,JPO&INPIT |
