| 摘要 |
<p>A wire bonding apparatus is provided to form the wire ball normally by heating the inactive gas and supplying the inactive gas to the end of the wire. The wire bonding apparatus prevents the oxide film from being formed on the wire(40) by spraying the inactive gas to the bonding area. The wire bonding apparatus more includes the heating portion(400). The heating portion heats up the inactive gas before the inactive gas is emitted. The heating portion bonds the wire which is made of the copper or the copper alloy to the chip pad(12) and the lead(20). The wire gas supply tube supplies the inactive gas which is heated by the heating portion to the end of wire.</p> |
