| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrostatic chuck wherein the inter-surface variation of such a plate-form sample as a semiconductor wafer applied to it is made small, and the adjusting of its age-based temperature-variation accompanied by a plasma applied to it and the adjusting of its temperature in a wide temperature-scope are made possible, and further, its local temperature-control is made possible too. SOLUTION: The electrostatic chuck has a mounting plate 11 having a mounting surface 11a for mounting thereon a plate-form sample, a supporting plate 12 so integrated with the mounting plate 11 as to support the mounting plate 11, an electrostatic chuck portion 2 having an internal electrode 13 for electrostatic attraction which is interposed between the mounting plate 11 and the supporting plate 12, and a cooling base portion 3 fastened to the electrostatic chuck portion 2. Hereupon, a heater 4 is so interposed between the electrostatic chuck portion 2 and the cooling base portion 3 as to be contacted with the electrostatic chuck portion 2 directly or via an intermediate layer having a thickness not larger than 0.5 mm, and as to be fastened to the cooling base portion 3 by an insulating adhesive layer 5. COPYRIGHT: (C)2009,JPO&INPIT |
