PRODUCTION PROCESS OF ELECTRONIC COMPONENT PACKAGE, PRODUCTION PROCESS OF WAFER FOR THE ELECTRONIC COMPONENT PACKAGE, AND PRODUCTION PROCESS OF BASIC STRUCTURE FOR THE ELECTRONIC COMPONENT PACKAGE

摘要

PROBLEM TO BE SOLVED: To mass-produce electronic components at low cost, in a short time.

SOLUTION: In a production process of the electronic component package, two or more sets of external connection terminals 11 corresponding to two or more electronic packages are formed, on a substrate 10 in a plating method so that a wafer 1 is formed. In the wafer 1, two or more base scheduled portions 2, which become each base of the electronic package through mutual separation are included. Then, at least one electronic part chip 3 is jointed to each base schedule portion 2 in the wafer 1. The electrode of the electronic part chip 3 is connected to the external connection terminal 11, and the electronic component chip 3 is sealed. Then, the wafer 1 is cut so that each base schedule portion 2 is separated from each other, to form two or more bases.

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