发明名称 |
Wiring board and a semiconductor device using the same |
摘要 |
A wiring board includes a core composite layer having first and second core boards and an optical transmission portion; first electrodes disposed on one part of the core composite layer, being adapted to mount an optical semiconductor module on the core composite layer; upper and lower core board wirings disposed on another part of and beneath the core composite layer; and upper and lower build-up wirings stacked on the upper and lower core board wirings, being adapted to mount semiconductor modules.
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申请公布号 |
US7463491(B2) |
申请公布日期 |
2008.12.09 |
申请号 |
US20070707106 |
申请日期 |
2007.02.16 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
YAMADA HIROSHI;TAKAOKA KEIJI;FURUYAMA HIDETO |
分类号 |
H05K7/00;G02B6/12;G02B6/42;G02B6/43;H01L23/12;H05K1/02;H05K1/18;H05K3/46 |
主分类号 |
H05K7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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