| 摘要 |
PROBLEM TO BE SOLVED: To prevent a semiconductor device malfunction arising due to switchover upon switching a connection relationship between terminals provided in the semiconductor device. SOLUTION: In a chip 120, a transferring portion 150 is provided between a physical layer processor 130 and a link portion 180 to transfer data of a plurality of lanes processed by the physical layer processor 130 to a link portion 180. The transferring portion 150 has a plurality of transferring portion input terminals which respectively input data of the lanes processed by the physical layer processor 130, a transferring portion output terminal which outputs data inputted from any one of the transferring portion input terminals to each of the input terminals of the link portion 180, and a switchover portion which switches data inputted from any one of the transferring portion input terminals for output via each of the transferring portion output terminals according to a control signal from a control signal terminal 160. COPYRIGHT: (C)2009,JPO&INPIT
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