发明名称 Telemetric Orthopaedic Implant
摘要 An instrumented orthopaedic implant, such as an intramedullary (IM) nail, is disclosed. The implant has the capacity to provide an accurate measurement of the applied mechanical load across the implant. The implant includes sensors and associated electronic components located in recesses on the outer surface of the implant. The implant houses the sensing apparatus, the interface circuitry, the data transmitter, and the power receiver. The hermetically sealed housing is adapted for implantation in the body of a patient. The implant is used with a controller which communicates with it by telemetry, and there is an acting unit connected to the electronic components which is adapted to carry out a function based upon a condition detected by the sensors.
申请公布号 US2008300597(A1) 申请公布日期 2008.12.04
申请号 US20060064546 申请日期 2006.08.23
申请人 SMITH & NEPHEW, INC. 发明人 MORGAN ROBERT L.;WICKHAM MARK DAVID;BRADY PETER A.;JANNA SIED W.;AUSTIN GENE EDWARD;WILSON DARREN JAMES
分类号 A61B17/56;A61B5/00;A61F2/28 主分类号 A61B17/56
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