发明名称 |
LEAD FRAME AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD THEREOF |
摘要 |
The present invention includes a plurality of mounting portions on which a semiconductor element is mounted, a plurality of electrodes to which the semiconductor elements that are mounted on each of the mounting portions are electrically connected, a corner portion which connects the plurality of mounting portions and which has a hanging lead piece that supports the mounting portions and an electrode connection piece that connects the plurality of electrodes, and a half-blanking portion that has a concave portion formed in a thickness direction of the lead frame and a protrusion formed at a position corresponding to the concave portion, and which is covered with a sealing resin material that seals the semiconductor element. A stress-dispersing portion for dispersing stress that arises, when the half-blanking portion is formed, is provided in the corner portion.
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申请公布号 |
US2008296746(A1) |
申请公布日期 |
2008.12.04 |
申请号 |
US20080129297 |
申请日期 |
2008.05.29 |
申请人 |
NEC ELECTRONICS CORPORATION;HITACHI CABLE PRECISION CO., LTD. |
发明人 |
SAIKI AKIMI;SHOJI HIROYUKI;TAKAHASHI GOUSUKE;HASEGAWA NORIYUKI;TAKANO FUMIO;SATO KOUJI |
分类号 |
H01L23/495;H01L21/56;H01R43/00 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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