| 摘要 |
The invention relates to a gripper (1), in particular a Bernoulli gripper for holding two-dimensional components such as silicon-based wafers (2) wit h a low degree of loading, having a clamping ring (4) connected to a control lable robot arm (3), having a baffle plate (6) which is connected to the cla mping ring (4) by means of a funnel-shaped component (5) and has a gripping face (7) which communicates with a flow system (8) which passes through the funnel-shaped component (5) and the baffle plate (6) and by means of which, after an excess pressure has been applied to the Bernoulli gripper (1), a ne gative pressure is to be produced on the gripping face (7) of the baffle pla te (6) in order to attach by suction the wafer (2) to be gripped, having a r ubberized bearing surface (9) of a bearing ring (10) which is integrated in the gripping face (7) and provides a slip-resistant movement of the wafer (2 ) attached to the gripping face (7) by suction, and having a sensor (11) for detecting the wafer (2) attached to the gripping face (7) by suction. In or der to permit an extremely shock-resistant attachment of the wafer to be gri pped on the gripping face of the gripper, the invention provides a damping d evice (12) which is circumferentially adapted to the gripper (1), the contou r of which device, as viewed in the plan view of the gripper (1), protrudes circumferentially above the contour of the latter, and which device forms su ch a damping resistance for the wafer (2) to be gripped during its suction-i nduced approach towards the gripping face (7) that the wafer (2) comes to be ar in a shock-free manner against the rubberized bearing surface (9) of the bearing ring (10).
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