| 摘要 |
PROBLEM TO BE SOLVED: To obtain a photocurable composition that improves reworkability as a sealing material while having a proper hardness and a gasket for electronic components using the same. SOLUTION: In the photocurable composition comprising a photocurable liquid resin, a (meth)acrylate monomer and a photopolymerization initiator, the photocurable liquid resin comprises a hydrogenated conjugated diene-aromatic vinyl copolymer containing a photocurable functional group and the photopolymerization initiator contains at least an aminoacetophenone-based photopolymerization initiator. The gasket for electronic components uses the photocurable composition. COPYRIGHT: (C)2009,JPO&INPIT |
