发明名称 PRINTED CIRCUIT BOARD AND METHOD FOR FABRICATING THEREOF
摘要 A printed circuit board and method for fabricating thereof is provided to realize a minute circuit by including the circuit pattern into an insulating layer and reducing the thickness of the printed circuit board. In a printed circuit board and method for fabricating thereof, an insulating layer(6) is mead of epoxy resin and blocks electrically blocking circuit patterns(10a, 10b) on both sides. A circuit pattern is formed on both sides of the insulating layer so that it is built inside the insulating layer. The insulating layer and the circuit pattern are adhered by an adhesive as the epoxy form lower than that of the insulating layer by Tg(glass transition temperature).
申请公布号 KR20080104938(A) 申请公布日期 2008.12.03
申请号 KR20070121026 申请日期 2007.11.26
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 MOK, JEE SOO;PARK, JUN HEYOUNG
分类号 H05K3/46;H05K1/14 主分类号 H05K3/46
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