SEMICONDUCTOR MODULE FOR ELECTRIC POWER

摘要

It is intended to inhibit any warpage of ceramic substratum and prevent any decrease of radiation efficiency. The semiconductor module includes a module housing suitable for fitting of a radiator and, held by the module housing, a common unit. The common unit includes a ceramic substratum with not only a circuit face fitted with a semiconductor element but also a radiation face abutting on the radiator and includes a package formed by, while exposing the radiation face, sealing the circuit face with the use of a heat-resistant resin. Each of the circuit face and the radiation face consists of metal layer (51) formed on the ceramic substratum. The metal layer (51) constituting the radiation face has, due to formation of buffer pattern (512) consisting of a groove portion extending along the peripheral border thereof, radiation pattern (510) provided inside the buffer pattern (512) and peripheral pattern (511) provided outside the buffer pattern (512). By virtue of this structuring, any warpage of ceramic substratum can be inhibited and any decrease of radiation efficiency can be prevented.