| 摘要 |
<p>In a method and system for transferring at least one of power and ground signal between a die and a package base of a semiconductor device (100), a connector (110) is formed there between. The connector, which is disposed above the die attached to the package base (120), includes a center pad (112) electrically coupled to the die by a plurality of conductive bumps and a finger (114) extending outward from the center pad towards the package base. The finger is electrically coupled to the package base by a conductive pad. A plurality of bond wires is formed to electrically couple the package base and the die. A resistance of a conductive path via the connector is much less than a resistance of a conductive path via any one of the plurality of bond wires to facilitate an efficient transfer of the at least one of power and ground signal.</p> |
