| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring structure which is excellent in the flatness of wiring and capable of sufficiently coping with smaller terminals of electronic components by sufficiently enhancing connection strength and connection reliability even if the aspect ratio of a connection hole is high, and to provide a substrate achieved in further micronization and lower profile. <P>SOLUTION: In a substrate 1 on which electronic components are mounted, a resin layer is formed on one surface (lower surface in figure) of a base body with the electronic component 30 embedded in the resin layer. On the other surface of the base body, wiring 51 is formed and both the wiring are electrically connected to each other at a connection part 13. The connection part 13 has such wiring structure that the wiring 51 is directly connected to a bump 32 which is arranged in a connection hole 14 and whose tip is exposed with a conductor 12 formed around it. <P>COPYRIGHT: (C)2009,JPO&INPIT |
