| 摘要 |
<p>A method and apparatus for forming plated liquid crystalline polymer substrates which includes placing a plated liquid crystalline polymer substrate on or within a fixture and applying vacuum and heat to the fixture and the plated liquid crystalline polymer substrate. The plated liquid crystalline polymer substrate may contain printed circuits and can be formed to any shape, configuration, and size without destroying the printed circuits contained on the liquid crystalline polymer substrate.</p> |
