发明名称 |
METHODS OF MAKING QFN PACKAGE WITH POWER AND GROUND RINGS |
摘要 |
A method to manufacture a package that encases at least one integrated circuit device and the package so manufactured. The method includes the steps of (1) providing a leadframe having a die pad, leads, at least one ring circumscribing the die pad and disposed between the die pad and the leads, a plurality of tie bars projecting outwardly from the at least one ring, and at least one connecting bar electrically interconnecting and mechanically supporting the die pad to the ring; (2) affixing the at least one integrated circuit device to a first side of the die pad and electrically interconnecting the at least one integrated circuit device to the leads and to the at least one ring; (3) encapsulating the at least one integrated circuit device, the first side of the die pad and a first side of the ring in a molding resin while retaining an opposing second side of the ring external to said molding resin; and (4) severing the at least one connecting bar to electrically isolate the die pad from the ring. |
申请公布号 |
EP1994551(A2) |
申请公布日期 |
2008.11.26 |
申请号 |
EP20070752973 |
申请日期 |
2007.03.13 |
申请人 |
ADVANCED INTERCONNECT TECHNOLOGIES LIMITED;ADVANCED INTERCONNECT TECHNOLOGIES, INC. |
发明人 |
SAN ANTONIO, ROMARICO, S.;SUBAGIO, ANANG |
分类号 |
H01L21/48;H01L23/495 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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