发明名称 |
Light source module, backlight assembly having the same, display apparatus having the backlight assembly, and method thereof |
摘要 |
A light source module includes a power supply plate (210), a light emitting chip (220), and a body mold (230). The light emitting chip is disposed on the power supply plate to lean to one side with respect to a center of the power supply plate along a first direction and electrically connected to the power supply plate. The body mold is connected with the power supply plate to expose the light emitting chip. Therefore, a thickness of a backlight assembly employing the light source module may be reduced. |
申请公布号 |
EP1995795(A2) |
申请公布日期 |
2008.11.26 |
申请号 |
EP20080005720 |
申请日期 |
2008.03.27 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
WOO, SEUNG-GYUN;CHU, YOUNG-BEE;LEE, IK-SOO |
分类号 |
F21S2/00;F21V8/00;F21V23/00;F21Y101/02;G02F1/13357;H05B37/02 |
主分类号 |
F21S2/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|