| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that a crack is formed in a bonding surface due to difference in a thermal expansion in each of materials, because a ceramics base member is fitted to a metallic base board through a metallic layer and a solder in a conventional ceramic electronic circuit board. SOLUTION: A melt is obtained by melting aluminum or aluminum alloy in a vacuum or an inert gas. Thereafter, the melt is brought into contact with the ceramics base member inside a mold under the vacuum or the inert-gas atmosphere. At that time, the melt is rigidly bonded to the ceramics base member by retaining to cool in a direct contact without interposing the oxidized layer of a metal surface, to each interface, and the melt is bonded to the ceramics base member by means of a brazing material. Otherwise, the melt is bonded to the ceramics base member in the order opposite to the above-described procedure. The metallic base board is specified to have a resistive strength of 320 MPa or less and a thickness of 1 mm or more. COPYRIGHT: (C)2009,JPO&INPIT
|
