| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent resin burr from being formed on an exposed surface of a heat sink. <P>SOLUTION: A semiconductor chip 13 is mounted on a die pad 12 of a lead frame 11. A heat sink 18 is arranged on a surface of the die pad 12 opposite to the semiconductor chip 13 side through an insulating resin sheet 19. In order that the surface of the heat sink 18 opposite to the semiconductor chip 13 side may be exposed, the semiconductor chip 13, the die pad 12, the insulating resin sheet 19, and the heat sink 18 are resin-sealed with a mold resin 20. An average ten-point height of the surface of the heat sink 18 opposite to the semiconductor chip 13 side is 3-8μm. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
