| 摘要 |
PROBLEM TO BE SOLVED: To obtain a multilayer structure metal mask in which by putting an electroless plating layer the difference of plate thicknesses between a region inside the pattern region and a region outside the pattern region becomes smaller and the plate thickness of the region outside the pattern region becomes thicker as compared with electroplating, the strength as the metal mask entirety is raised, and the elongation at the time of printing can be decreased. SOLUTION: The multilayer structure metal mask has a multilayer type film structure formed of an electroplating layer formed on an odd number layer including the first layer, and a electroless plating layer formed on an even number layer including the second layer. A manufacturing process of the multilayer structure metal mask includes the steps of applying a sensitive film resist on a base material, baking and hardening the sensitive film resist by exposure, removing a resist part which was not hardened to form the resist part which was hardened to become a pattern on the base material, forming an electroplating layer as the first layer on a part on which a resist part is not formed on the substrate, forming the electroless plating layer as the second layer on the electroplating layer of the first layer, removing the hardened resist part, and stripping the electroplating layer and the electroless plating layer from the base material. COPYRIGHT: (C)2009,JPO&INPIT |
