Modular aufgebautes Leistungshalbleitermodul

摘要

The power semiconductor module comprises partial modules (10), which have a housing (14). The housing is fitted to the power semiconductor module in an assembled condition with side surfaces (12,34). The partial modules are connected with each other by connecting elements in the power semiconductor module. The connecting elements are formed at the side surface of the respective partial module by form-stable locking element (36) and at another side surface by moderate-form of counter-locking element (16).