| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling mechanism for efficiently causing a local turbulent flow to cool a specific heating electronic component without contact. SOLUTION: The cooling mechanism comprises a substrate 1, the heat releasing electronic component 3 mounted to the substrate 1, a hemispherical dome 11 provided to cover the component 3 and a cooling fan 4 for blowing air to the component 3 covered with the dome 11 along the substrate 1. The dome 11 has part of its wall surface opened sectorially from a top to its base and also has a rectangular opening formed along the bottom of the dome 11. The air blown from the cooling fan 4 enters the sectorial opening and is exhausted from the rectangular opening. COPYRIGHT: (C)2009,JPO&INPIT |
