| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling structure for an electronic component for improving the cooling efficiency and also improving the production efficiency. SOLUTION: The cooling structure 10 of electronic component can radiate heat generated by an electronic component 2 with a heat sink 4 for receiving air-flow with the one surface thereof and provided with the electronic component 2 at the other surface thereof, and the cooling structure 10 is provided with an air receiving part (intake port) 11 for receiving air-flow to cool the heat sink and a pipe 5, including a ventilating part 13, to supply the received air-flow to the front surface of the electronic component; and the pipe is arranged slidably within a through-hole provided to the heat sink and is fixed at the front surface of the electronic component, in a state where the air receiving part is projected. COPYRIGHT: (C)2009,JPO&INPIT
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