发明名称 |
Multi layer low cost cavity substrate fabrication for pop packages |
摘要 |
In a method and system for fabricating a semiconductor device ( 100 ) having a package-on-package structure, a base laminate substrate (BLS) ( 110 ) is formed to include a base center portion ( 112 ) and a peripheral portion ( 114 ) separated by a barrier element ( 120 ). The barrier element ( 120 ) forms a peripheral wall ( 118 ) to surround the base center portion ( 112 ). A frame shaped top laminate substrate (TLS) ( 130 ) is disposed over the peripheral portion ( 114 ) of the BLS ( 110 ). The TLS ( 130 ) has an open top center portion ( 132 ) matching the base center portion ( 112 ) surrounded by the peripheral wall ( 118 ) to form a cavity ( 140 ). A plurality of conductive bumps ( 150 ) each disposed between a top contact pad ( 134 ) of the TLS and a base contact pad ( 116 ) of the peripheral portion ( 114 ) of the BLS ( 110 ) are formed to provide electrical and mechanical coupling therebetween. The barrier element ( 120 ) forms a seal between the cavity ( 140 ) and the plurality of conductive bumps ( 150 ).
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申请公布号 |
US2008283992(A1) |
申请公布日期 |
2008.11.20 |
申请号 |
US20070804237 |
申请日期 |
2007.05.17 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
PALANIAPPAN PREMA;MURTUZA MASOOD;CHAUHAN SATYENDRA SINGH |
分类号 |
H01L23/12;H01L21/50 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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