发明名称 Multi layer low cost cavity substrate fabrication for pop packages
摘要 In a method and system for fabricating a semiconductor device ( 100 ) having a package-on-package structure, a base laminate substrate (BLS) ( 110 ) is formed to include a base center portion ( 112 ) and a peripheral portion ( 114 ) separated by a barrier element ( 120 ). The barrier element ( 120 ) forms a peripheral wall ( 118 ) to surround the base center portion ( 112 ). A frame shaped top laminate substrate (TLS) ( 130 ) is disposed over the peripheral portion ( 114 ) of the BLS ( 110 ). The TLS ( 130 ) has an open top center portion ( 132 ) matching the base center portion ( 112 ) surrounded by the peripheral wall ( 118 ) to form a cavity ( 140 ). A plurality of conductive bumps ( 150 ) each disposed between a top contact pad ( 134 ) of the TLS and a base contact pad ( 116 ) of the peripheral portion ( 114 ) of the BLS ( 110 ) are formed to provide electrical and mechanical coupling therebetween. The barrier element ( 120 ) forms a seal between the cavity ( 140 ) and the plurality of conductive bumps ( 150 ).
申请公布号 US2008283992(A1) 申请公布日期 2008.11.20
申请号 US20070804237 申请日期 2007.05.17
申请人 TEXAS INSTRUMENTS INCORPORATED 发明人 PALANIAPPAN PREMA;MURTUZA MASOOD;CHAUHAN SATYENDRA SINGH
分类号 H01L23/12;H01L21/50 主分类号 H01L23/12
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