| 摘要 |
<P>PROBLEM TO BE SOLVED: To enable inexpensive and efficient manufacture of a compact imaging element module. <P>SOLUTION: An IR cut glass 14 as a light transmitting member is bonded onto an imaging element 12a with a first adhesive 15 so as to cover the upper side of an effective pixel region in the imaging element 12a provided on a base circuit board 11a. The upper surface of the IR cut glass 14 is formed to be flat. A lens member 17 is bonded on the upper surface of the IR cut glass 14 with a second adhesive 18 disposed therebetween. The lens member 17 has a lens 17b for condensing light into the effective pixel region of the imaging element 12a and a light transmitting support 17a provided at the periphery of the lens 17b to expose the upper part of the lens 17b and configured to have a lower flat surface. The imaging element 12a, the IR cut glass 14, and the lens member 17 are molded with a light non-transmitting mold resin. <P>COPYRIGHT: (C)2009,JPO&INPIT |
