| 摘要 |
<P>PROBLEM TO BE SOLVED: To simply and reliably connect an extra-thin metal back surface electrode layer on a glass substrate that cannot be soldered easily and has low mechanical strength to a ribbon wire at low cost, and to prevent strain or damage caused by a difference in a thermal expansion coefficient between the glass substrate and a connection material. <P>SOLUTION: In a connection method of connecting the ribbon wire 2 to the extra-thin metal back surface electrode layer 1C of a CIS-system thin-film solar cell module 1, the preliminary solder 3 of solder formed of In or an In-Ag alloy is performed to the entire upper surface of the extra-thin metal back surface electrode layer 1C on the edge of the glass substrate 1A, or a soldered place (see Fig. 3) before the ribbon wire 2 plated to copper foil with Sn is placed on the metal back surface electrode layer 1C, and an ultrasonic soldering iron 4 is put on the ribbon wire 2 to solder the metal back surface electrode layer 1C and the ribbon wire 2. <P>COPYRIGHT: (C)2009,JPO&INPIT |
