Polymer and ceramic composite electronic substrates
摘要
<p>A composite electronic and/or optical substrate including polymeric and ceramic material wherein the composite substrate has a dielectric constant less than 4 and a coefficient of thermal expansion of 8 to 14 ppm/ °C at 100°C. The composite substrate may be either ceramic- filled polymeric material or polymer-filled ceramic material.</p>
申请公布号
EP1168436(A3)
申请公布日期
2008.11.19
申请号
EP20010305287
申请日期
2001.06.18
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人
BERGER, DANIEL GEORGE;FAROOQ, SHAJI;HERRON, LESTER WYNN;HUMENIK, JAMES N.;KNICKERBOCKER, JOHN ULRICH;PASCO, ROBERT WILLIAM;PERRY, CHARLES H.;SACHDEV, KRISHNA G.
