LEAD FRAME FOR MOUNTING OF LIGHT EMITTING DIODE CHIP AND METHOD MANUFACTURING THE SAME

摘要

The luminous efficiency and lifetime can be increased by designing the structure for improving heat radiation. The freedom of design can be increased. The lead frame assembly for the light emitting diode chip mounting comprises the first lead frame part(7); the second lead frame part(9) which is separated from the first lead frame part in a constant distance; the package part(5) formed between The first lead frame part and the second lead frame at the side part to expose a part of the lower and upper surface. The first lead frame part, and the second lead frame part and package part are consecutively arranged in the outer frame. One of the first lead frame part or the second lead frame part is arranged in the central part.