METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

摘要

The manufacturing method of the semiconductor package for minimizing the initial warpage phenomenon of the strip level substrate is provided. The manufacturing method of the semiconductor package is provided. A step is for coating the solder resist(120) on the strip level of the substrate(100) including a plurality of unit substrates(110) divided with the scribe line(102). A step is for exposing the electrode terminal(112) at each unit substrate and ball land by patterning the coated solder resist. The patterning of the solder resist is performed so that the solder resist part coated onto on the scribe line is removed together to reduce the initial warpage of the strip level substrate.