PROBLEM TO BE SOLVED: To provide semiconductor devices that are enhanced in reliability of bump connection. SOLUTION: The semiconductor device in the present invention comprises an electrode pad 24 on an active surface 121a and a bump electrode 10 conductively connected to the electrode pad 24. The bump electrode 10 has a resin projection 12 formed on the active surface 121a and a conductive film placed on the surface covering from the electrode pad 24 to the resin projection 12 and a conductive film 20, and the conductive film 20 and the resin projection 12 are arranged unadhered. COPYRIGHT: (C)2009,JPO&INPIT
