| 摘要 |
PROBLEM TO BE SOLVED: To satisfactorily dice a wafer which is thick in the peripheral section, and which is thin in the central section. SOLUTION: This method for dicing a wafer 10 which is thick in the peripheral section and which is thin in the central section formed with a plurality of circuit patterns as semiconductor elements to manufacture the pieces of the semiconductor elements includes a process (a) for cutting the peripheral section by a first blade 31 by leaving thickness which can be cut by a second blade 32 whose blade width is smaller than that of the first blade 31 and a process for cutting the remaining section in the process (a) and the central part by the second blade 32. COPYRIGHT: (C)2009,JPO&INPIT
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