| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve size reduction and high operation speed of a semiconductor device, and to enhance electrical reliability and mounting accuracy thereof. <P>SOLUTION: In a semiconductor device in which a semiconductor pellet 2 is mounted on a pellet mounting area of the main surface of a base substrate 1, and first electrode pads 1B arranged on the back surface of the base substrate 1 are electrically connected to an external terminal 2A arranged on the main surface of the semiconductor pellet 2, the base substrate 1 is formed of a rigid substrate, and the first electrode pads 1B of the base substrate 1 are electrically connected to the second electrode pads 1A arranged on the back surface of the base substrate 1. The semiconductor pellet 2 is mounted on the pellet mounting area of the main surface of the base substrate 1, with its main surface downward, and the external terminal 2A of the semiconductor pellet 2 is electrically connected to the second electrode pads 1A of the base substrate 1 by bonding wires 6 through a slit 5 formed in the base substrate 1. <P>COPYRIGHT: (C)2009,JPO&INPIT |
